110-43-632-41-001000

Mill-Max
575-11043632
110-43-632-41-001000

Mfr.:

Description:
IC & Component Sockets 32P TIN PIN GLD CONT

Datasheet:
ECAD Model:
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Learn more about Mill-Max 110-43-632-41-001000

In Stock: 213

Stock:
213
Can Dispatch Immediately
On Order:
132
Expected 16/02/2026
Factory Lead Time:
2
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp89.162 Rp89.162
Rp72.100 Rp865.200
Rp67.880 Rp1.629.120
Rp65.128 Rp3.907.680
Rp64.945 Rp7.014.060
Rp61.459 Rp15.487.668
Rp58.524 Rp29.496.096
Rp55.772 Rp56.218.176
Rp52.286 Rp131.133.288

Non-RoHS Version

Mill-Max 110-93-632-41-001000
Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL DIP SOCKET
Compare With Current Part

Product Attribute Attribute Value Select Attribute
Mill-Max
Product Category: IC & Component Sockets
RoHS:  
DIP / SIP Sockets
32 Position
2 Row
Open Frame
2.54 mm
Solder Tail
Gold
15.24 mm
- 55 C
+ 125 C
0110
Tube
Brand: Mill-Max
Case Style: DIP
Contact Material: Beryllium Copper
Current Rating: 3 A
Features: DIP socket
Flammability Rating: UL 94 V-0
Housing Material: Polybutylene Terephthalate (PBT)
Mounting Style: Through Hole
Product Type: IC & Component Sockets
Factory Pack Quantity: 12
Subcategory: IC & Component Sockets
Voltage Rating: 1 kV
Unit Weight: 5,024 g
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Attributes selected: 0

Datasheet

CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Series 110 Open-Frame Dual-In-Line Sockets

Mill-Max Series 110 Open-Frame Dual-In-Line Sockets accept 0.015" to 0.025" diameter and standard IC leads. The four-finger beryllium copper #30 contact offers high reliability and is rated at 3A. The sockets feature a standard solder tail. Mill-Max Series 110 Open-Frame Dual-In-Line Sockets use MM #1001 pins and the insulators are high-temperature thermoplastic, making them suitable for all soldering operations.

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