Backplate size_92.5x89x6.3mm

ADLINK Technology
976-BACKPLATESIZE_92
Backplate size_92.5x89x6.3mm

Mfr.:

Description:
Modules Accessories 1. 32-50031-0000-A02. Backing plate for INTEL 115X socket CPU3. Mylar with adhesive4. Backplate: 75x75mm5. Material: SPCC

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp185.111 Rp185.111
Rp175.938 Rp1.759.380
Rp166.582 Rp4.164.550
Rp148.052 Rp7.402.600
Rp144.933 Rp14.493.300
Rp138.879 Rp34.719.750
Rp129.523 Rp64.761.500
Rp123.102 Rp123.102.000

Product Attribute Attribute Value Select Attribute
ADLINK Technology
Product Category: Modules Accessories
Backplates
Intel 115X socket CPU3
Brand: ADLINK Technology
Dimensions: 92.5mm x 89 mm x 6.3 mm
Product Type: Modules Accessories
Factory Pack Quantity: 1
Subcategory: Embedded Solutions
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

Origin Classifications
Country of Origin:
Not available
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.