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XC7S25-2CSGA324C

Name: AMD XC7S25-2CSGA324C
Brand: AMD / Xilinx
SKU: 217-XC7S25-2CSGA324C
Price: 743013 IDR
Availability: InStock

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Mouser No:

217-XC7S25-2CSGA324C

Mfr. No:

XC7S25-2CSGA324C

Mfr.:

AMD / Xilinx

Description:

FPGA - Field Programmable Gate Array XC7S25-2CSGA324C

Datasheet:

XC7S25-2CSGA324C Datasheet (PDF)

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Factory Lead Time:: 31 Weeks Estimated factory production time for quantities greater than shown.

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	Rp743.013	Rp743.013

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	AMD
Product Category:	FPGA - Field Programmable Gate Array
RoHS:
Series:	XC7S25
Number of Logic Elements:	23360 LE
Adaptive Logic Modules - ALMs:	3650 ALM
Embedded Memory:	1.58 Mbit
Number of I/Os:	150 I/O
Supply Voltage - Min:	950 mV
Supply Voltage - Max:	1.05 V
Minimum Operating Temperature:	0 C
Maximum Operating Temperature:	+ 85 C
Mounting Style:	SMD/SMT
Package/Case:	CSGA-324
Brand:	AMD / Xilinx
Distributed RAM:	313 kbit
Embedded Block RAM - EBR:	1620 kbit
Moisture Sensitive:	Yes
Number of Logic Array Blocks - LABs:	1825 LAB
Operating Supply Voltage:	1 V
Product Type:	FPGA - Field Programmable Gate Array
Factory Pack Quantity:	126
Subcategory:	Programmable Logic ICs
Tradename:	Spartan

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Datasheet

XC7S25-2CSGA324C Datasheet (PDF)

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USHTS:: 8542310060
TARIC:: 8542399000
ECCN:: EAR99

Spartan®-7 Field Programmable Gate Arrays

Xilinx Spartan®-7 Field Programmable Gate Arrays feature a MicroBlaze™ soft processor running over 200 DMIPs with 800Mb/s DDR3 support built on 28nm technology. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. The Spartan-7 offer integrated analogue-to-digital converters, dedicated security features, and Q-grade (-40 to +125°C) on all commercial devices. Spartan-7 devices enable key connectivity and processing applications in industrial, automotive, consumer, and communications markets. Spartan-7 is among four FPGA families (Virtex-7, Artix-7, and Kintex-7 are the others) that address system requirements ranging from small form factor, cost-sensitive, high-volume applications to ultra-high-end connectivity bandwidth, logic capacity, and signal-processing capability.