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ATS-1106-C1-R0

Name: Advanced Thermal Solutions ATS-1106-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-1106-C1-R0
Price: 392971 IDR
Availability: InStock

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Mouser No:

984-ATS-1106-C1-R0

Mfr. No:

ATS-1106-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW Power Brick Heat Sink, Half Brick, Gold, T766, Hardware, 61x58x22.9mm

Datasheet:

ATS-1106-C1-R0 Datasheet (PDF)

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Learn more about Advanced Thermal Solutions ATS-1106-C1-R0

In Stock: 116

Stock:: 116 Can Dispatch Immediately

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Factory Lead Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp392.971	Rp392.971
	Rp360.132	Rp3.601.320
	Rp340.318	Rp6.806.360
	Rp338.117	Rp16.905.850
	Rp326.008	Rp32.600.800
	Rp301.241	Rp60.248.200
	Rp293.169	Rp146.584.500

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	DC/DC Converter, 1/2 Brick
Mounting Style:	Screw
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	1.3 C/W
Length:	61 mm
Width:	58 mm
Height:	22.9 mm
Brand:	Advanced Thermal Solutions
Color:	Gold
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	Brick HS
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW
Type:	DC/DC Converter
Unit Weight:	52,600 g

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Datasheet

ATS-1106-C1-R0 Datasheet (PDF)

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Technical Resources

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 7616991090
USHTS:: 8504909690
TARIC:: 7616991099
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.