ATS-51170K-C1-R0

Advanced Thermal Solutions
984-ATS-51170K-C1-R0
ATS-51170K-C1-R0

Mfr.:

Description:
Heat Sinks maxiFLOW BGA Heat Sink+maxiGRIP Attachment, T766, 17x17x14.5mm, 31.9mm Fin Tip

Datasheet:
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Learn more about Advanced Thermal Solutions ATS-51170K-C1-R0

In Stock: 46

Stock:
46 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp276.841 Rp276.841
Rp245.103 Rp2.451.030
Rp233.361 Rp4.667.220
Rp225.105 Rp11.255.250
Rp212.630 Rp21.263.000
Rp203.641 Rp40.728.200
Rp198.871 Rp99.435.500
2.000 Quote

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
Angled Fin
10.91 C/W
17 mm
17 mm
14.5 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: maxiGRIP HS ASM
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW maxiGRIP
Type: Component
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Attributes selected: 0

Datasheet

Test/Quality Data

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CNHTS:
7616991090
USHTS:
8542900000
TARIC:
7616991099
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink. 

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