ATS-51230K-C1-R0

Advanced Thermal Solutions
984-ATS-51230K-C1-R0
ATS-51230K-C1-R0

Mfr.:

Description:
Heat Sinks maxiFLOW BGA Heat Sink w/maxiGRIP Attachment, 23x23x14.5mm, 41.5mm Fin Tip

Datasheet:
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Learn more about Advanced Thermal Solutions ATS-51230K-C1-R0

In Stock: 84

Stock:
84 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 84 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp289.316 Rp289.316
Rp256.110 Rp2.561.100
Rp244.002 Rp4.880.040
Rp235.196 Rp11.759.800
Rp226.206 Rp22.620.600
Rp213.547 Rp42.709.400
Rp207.860 Rp103.930.000

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
Angled Fin
6.64 C/W
23 mm
23 mm
14.5 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: maxiGRIP HS ASM
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW maxiGRIP
Type: Component
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Attributes selected: 0

Datasheet

Test/Quality Data

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CNHTS:
7616991090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink. 

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