ATS-52150P-C1-R0

Advanced Thermal Solutions
984-ATS-52150P-C1-R0
ATS-52150P-C1-R0

Mfr.:

Description:
Heat Sinks maxiFLOW BGA Heat Sink, Double-Side Thermal Tape, T412, 15mm L, 15mm W, 17.5mm H

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
200
Expected 27/02/2026
Factory Lead Time:
13
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp259.779 Rp259.779
Rp240.149 Rp2.401.490
Rp226.023 Rp4.520.460
Rp211.896 Rp10.594.800
Rp203.457 Rp20.345.700
Rp193.734 Rp38.746.800
Rp186.762 Rp93.381.000
Rp181.625 Rp181.625.000

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
Adhesive
Aluminum
Angled Fin
8.7 C/W
15 mm
15 mm
17.5 mm
Brand: Advanced Thermal Solutions
Color: Blue
Packaging: Bulk
Product Type: Heat Sinks
Series: HS with TAPE
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW
Type: Component
Unit Weight: 3,150 g
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

CNHTS:
8548000090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

Heat Sinks

Advanced Thermal Solutions Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW™, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.