ATS-52210P-C1-R0

Advanced Thermal Solutions
984-ATS-52210P-C1-R0
ATS-52210P-C1-R0

Mfr.:

Description:
Heat Sinks maxiFLOW BGA Heat Sink, Double-Side Thermal Tape, T412, 21mm L, 21mm W, 17.5mm H

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 73

Stock:
73 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp244.369 Rp244.369
Rp216.116 Rp2.161.160
Rp206.026 Rp4.120.520
Rp198.504 Rp9.925.200
Rp185.478 Rp18.547.800
Rp176.672 Rp35.334.400
Rp171.902 Rp85.951.000
Rp165.664 Rp165.664.000

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
Adhesive
Aluminum
maxiFLOW
5.4 C/W
21 mm
21 mm
17.5 mm
Brand: Advanced Thermal Solutions
Color: Blue
Packaging: Bulk
Product Type: Heat Sinks
Series: HS with TAPE
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW
Type: Component
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.