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ATS-52330P-C2-R0

Name: Advanced Thermal Solutions ATS-52330P-C2-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-52330P-C2-R0
Price: 172819 IDR
Availability: OutOfStock

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Mouser No:

984-ATS-52330P-C2-R0

Mfr. No:

ATS-52330P-C2-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW BGA Heat Sink, Thermal Tape, Blue-Anodize, C675, 33x33x17.5mm

Datasheet:

ATS-52330P-C2-R0 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Advanced Thermal Solutions ATS-52330P-C2-R0

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 13 Weeks Estimated factory production time.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp172.819	Rp172.819
	Rp165.481	Rp1.654.810
	Rp156.308	Rp3.126.160
	Rp153.556	Rp7.677.800
	Rp130.257	Rp13.025.700
	Rp128.605	Rp25.721.000
	Rp123.469	Rp61.734.500
	Rp119.066	Rp119.066.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	Adhesive
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	2.66 C/W
Length:	33 mm
Width:	33 mm
Height:	17.5 mm
Brand:	Advanced Thermal Solutions
Color:	Blue
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	HS with TAPE
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW
Type:	Component
Part # Aliases:	ATS-50330P-C2-HS

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Datasheet

ATS-52330P-C2-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

CNHTS:: 7616991090
CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.