ATS-56003-C4-R0

Advanced Thermal Solutions
984-ATS-56003-C4-R0
ATS-56003-C4-R0

Mfr.:

Description:
Heat Sinks maxiFLOW BGA ASIC Cooling Heat Sink, High Performance, No TIM, 15x15x9mm

Datasheet:
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Learn more about Advanced Thermal Solutions ATS-56003-C4-R0

In Stock: 14

Stock:
14 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp309.130 Rp309.130
Rp273.539 Rp2.735.390
Rp260.697 Rp5.213.940
Rp251.157 Rp12.557.850
Rp241.800 Rp24.180.000
Rp228.041 Rp45.608.200
Rp222.170 Rp111.085.000
2.000 Quote

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
Adhesive
Aluminum
Angled Fin
12 C/W
15 mm
15 mm
9 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: HS with TAPE
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW
Type: Component
Unit Weight: 2 g
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Attributes selected: 0

Datasheet

Test/Quality Data

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CNHTS:
7616991090
USHTS:
8542900000
TARIC:
7616991099
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink. 

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