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ATS-56004-C1-R0

Name: Advanced Thermal Solutions ATS-56004-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-56004-C1-R0
Price: 366737 IDR
Availability: InStock

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Mouser No:

984-ATS-56004-C1-R0

Mfr. No:

ATS-56004-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW BGA ASIC Cooling Heat Sink, Performance, 2-Side Tape, T412, 40x30x5mm

Datasheet:

ATS-56004-C1-R0 Datasheet (PDF)

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Learn more about Advanced Thermal Solutions ATS-56004-C1-R0

In Stock: 63

Stock:: 63 Can Dispatch Immediately

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Factory Lead Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp366.737	Rp366.737
	Rp345.639	Rp3.456.390
	Rp325.275	Rp6.505.500
	Rp304.911	Rp15.245.550
	Rp287.115	Rp28.711.500
	Rp273.355	Rp54.671.000
	Rp263.449	Rp131.724.500

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	Adhesive
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	7.9 C/W
Length:	40 mm
Width:	30 mm
Height:	5 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	HS with TAPE
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW
Type:	Component
Unit Weight:	15,681 g

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Datasheet

ATS-56004-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 7616991090
CAHTS:: 8473309000
USHTS:: 8473305100
JPHTS:: 847330090
TARIC:: 7616991099
MXHTS:: 8473300499
ECCN:: EAR99

Heat Sinks

Advanced Thermal Solutions Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW™, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.