+65 6788-9233

Part of the TTI Family of Specialists Contact Mouser (Singapore) +65 6788-9233 Feedback

Change Location

English

In Stock

RoHS

Mfr.	Mfr. No:	Qty	Ext Total

View Basket

It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

ATS-56009-C4-R0

Name: Advanced Thermal Solutions ATS-56009-C4-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-56009-C4-R0
Price: 317019 IDR
Availability: InStock

Images are for reference only
See Product Specifications

Mouser No:

984-ATS-56009-C4-R0

Mfr. No:

ATS-56009-C4-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW BGA ASIC Cooling Heat Sink, High Performance, No TIM, 58x30x9mm

Datasheet:

ATS-56009-C4-R0 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Advanced Thermal Solutions ATS-56009-C4-R0

In Stock: 60

Stock:: 60 Can Dispatch Immediately

An unexpected error occurred. Please try again later.
Factory Lead Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp317.019	Rp317.019
	Rp280.143	Rp2.801.430
	Rp267.485	Rp5.349.700
	Rp242.718	Rp12.135.900
	Rp241.250	Rp24.125.000
	Rp233.912	Rp46.782.400
	Rp227.674	Rp113.837.000

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	Adhesive
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	3.7 C/W
Length:	58 mm
Width:	30 mm
Height:	9 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	HS with TAPE
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW
Type:	Component
Unit Weight:	32,792 g

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

ATS-56009-C4-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

This functionality requires JavaScript to be enabled.

CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.