ATS-61400R-C1-R0

Advanced Thermal Solutions
984-ATS-61400R-C1-R0
ATS-61400R-C1-R0

Mfr.:

Description:
Heat Sinks BGA fanSINK Assembly+maxiGRIP Attachment, T412, 39.25x39.25x19.5mm, 39.25mm Dia

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 88

Stock:
88 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp435.351 Rp435.351
Rp411.134 Rp4.111.340
Rp387.101 Rp7.742.020
Rp362.884 Rp18.144.200
Rp338.667 Rp33.866.700
Rp320.872 Rp64.174.400
Rp311.148 Rp155.574.000

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Fan Sink Assemblies
BGA
Snap On
Aluminum
Cross Cut Fin
2.2 C/W
40 mm
40 mm
19.5 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: ATS-61
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: fanSINK maxiGRIP
Type: Component
Unit Weight: 45,583 g
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

CNHTS:
7616991090
USHTS:
8473302000
TARIC:
7616991099
ECCN:
EAR99

fanSINK™ High Performance Heat Sinks

Advanced Thermal Solutions, Inc. (ATS) fanSINK™ High-Performance Heat Sinks feature a cross-cut straight-fin structure that allows for omnidirectional airflow for optimal thermal performance independent of the PCB layout. Depending on their size, the fanSINK can be securely clipped onto a device with the ATS maxiGRIP™ attachment system or by using standoff and spring hardware for direct attachment to the PCB. The stainless-steel screw fan attachment ensures a dependable long-term fan-to-heat sink connection (fan not included). These heat sinks include pre-assembled thermal interface material (TIM) centered on the base to ensure proper thermal transfer between the component and heat sink.