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ATS-MG190-R0

Name: Advanced Thermal Solutions ATS-MG190-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-MG190-R0
Price: 146218 IDR
Availability: InStock

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Mouser No:

984-ATS-MG190-R0

Mfr. No:

ATS-MG190-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks clipKIT Attachment Heat Sink to PCB for Component Size 19x19mm, maxiGRIP Tech

Datasheet:

ATS-MG190-R0 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Advanced Thermal Solutions ATS-MG190-R0

In Stock: 98

Stock:: 98 Can Dispatch Immediately

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Factory Lead Time:: 8 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp146.218	Rp146.218
	Rp133.559	Rp1.335.590
	Rp126.037	Rp2.520.740
	Rp118.882	Rp5.944.100
	Rp112.094	Rp11.209.400
	Rp105.673	Rp21.134.600
	Rp102.921	Rp51.460.500
	Rp99.252	Rp99.252.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Accessories and Hardware
Designed for:	Component, 19x19mm
Mounting Style:	Clip
Length:	19 mm
Width:	19 mm
Brand:	Advanced Thermal Solutions
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	ATS-MG
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	clipKIT maxiGRIP
Type:	Component

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Filter Document:

Datasheet

ATS-MG190-R0 Datasheet (PDF)

Specification Sheets

maxiGRIP™ Datasheet (PDF)

Technical Resources

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

Videos

Heat Sink Attachments

Compliance Codes

USHTS:: 7326908688
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

maxiGRIP™ clipKIT™ Heat Sink Attachments

Advanced Thermal Solutions maxiGRIP™ clipKIT™ Heat Sink Attachments feature a two-component system that quickly and securely mounts heat sinks to a range of hot-running Ball Grid Array (BGA) components. These attachments use a minimal amount of space on a PCB, eliminate the need to drill holes and allow the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.