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ATS-SG210-R0

Name: Advanced Thermal Solutions ATS-SG210-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-SG210-R0
Price: 168967 IDR
Availability: InStock

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Mouser No:

984-ATS-SG210-R0

Mfr. No:

ATS-SG210-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks clipKIT Attachment Heat Sink to PCB for Component Size 21x21mm, superGRIP Tech

Datasheet:

ATS-SG210-R0 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Advanced Thermal Solutions ATS-SG210-R0

In Stock: 197

Stock:: 197 Can Dispatch Immediately

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Factory Lead Time:: 8 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp168.967	Rp168.967
	Rp150.988	Rp1.509.880
	Rp143.833	Rp2.876.660
	Rp138.696	Rp6.934.800
	Rp136.311	Rp13.631.100
	Rp125.854	Rp25.170.800
	Rp122.551	Rp61.275.500
	Rp118.148	Rp118.148.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Accessories and Hardware
Designed for:	Component, 21x21mm
Mounting Style:	Clip
Length:	21 mm
Width:	21 mm
Brand:	Advanced Thermal Solutions
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	ATS-SG
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	clipKIT superGRIP
Type:	Component
Unit Weight:	4,730 g

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Filter Document:

Datasheet

ATS-SG210-R0 Datasheet (PDF)

Specification Sheets

superGRIP™ Datasheet (PDF)

Technical Resources

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

Videos

Heat Sink Attachments

Compliance Codes

USHTS:: 3926909989
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

superGRIP™ clipKIT™ Heat Sink Attachments

Advanced Thermal Solutions superGRIP™ clipKIT™ Heat Sink Attachments promote a two-component system that quickly and securely mounts heat sinks to a range of hot-running Ball Grid Array (BGA) components. These attachments are ideal for densely populated PCBs with minimal space around mechanical attachment components. ATS superGRIP heat sink attachments eliminate the need to drill holes, which allows the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.