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ATS-VC-012-C1-R2

Name: Advanced Thermal Solutions ATS-VC-012-C1-R2
Brand: Advanced Thermal Solutions
SKU: 984-ATS-VC-012-C1-R2
Price: 2755019 IDR
Availability: OutOfStock

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Mouser No:

984-ATS-VC-012-C1-R2

Mfr. No:

ATS-VC-012-C1-R2

Mfr.:

Advanced Thermal Solutions

Description:

Liquid Cold Plates, Liquid Cooling & Heat Pipes Vapor Chamber, Acetone, Mesh Wick, Aluminum, 150mm L, 150mm W, 0.8mm H, 6W qMax

Datasheet:

ATS-VC-012-C1-R2 Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 13 Weeks Estimated factory production time.

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Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp2.755.019	Rp68.875.475
	Rp2.655.584	Rp132.779.200

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Liquid Cold Plates, Liquid Cooling & Heat Pipes
RoHS:
Product:	Vapor Chambers
Type:	Mesh Vapor Chamber
Heatsink Material:	Aluminum
Length:	150 mm
Width:	150 mm
Height:	0.8 mm
Designed for:	Thermal Management Applications
Brand:	Advanced Thermal Solutions
Packaging:	Bulk
Product Type:	Thermal Interface Products
Series:	ATS-VC
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Unit Weight:	69,120 g

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USHTS:: 7616995190
JPHTS:: 761699000
BRHTS:: 76169900
ECCN:: EAR99

ATS-VC Aluminum Vapor Chambers

Advanced Thermal Solutions ATS-VC Aluminum Vapor Chambers are vacuum-sealed heat spreaders with a wick structure lining the inside walls. These unique cooling solutions are used in high-power density or total power applications where a traditional heat sink becomes conduction-limited. The ATS-VC vapor chambers quickly spread heat in multiple directions and allow for cooling to get close to the heat source. These vapor chambers are available in 25mm x 25mm to 250mm x 250mm dimensions and less than 6mm in thickness. The ATS-VC vapor chambers feature mesh or groove wick type and Acetone as the working fluid. These vapor chambers include no moving parts and require no external parts. The ATS-VC vapor chambers are ideal for graphic card cooling, PCs, LED cooling, mobile devices, Solid State Disk Drive (SSD) cooling, and servers.