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ATS-X50210B-C1-R0

Name: Advanced Thermal Solutions ATS-X50210B-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-X50210B-C1R0
Price: 332796 IDR
Availability: InStock

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Mouser No:

984-ATS-X50210B-C1R0

Mfr. No:

ATS-X50210B-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW Heat Sink w/superGRIP Attachment, T766, 20.25x20.25x7.5mm

Datasheet:

ATS-X50210B-C1-R0 Datasheet (PDF)

ECAD Model:

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Learn more about Advanced Thermal Solutions ATS-X50210B-C1-R0

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2.950 Can Dispatch in 20 Days

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp332.796	Rp33.279.600
	Rp316.285	Rp63.257.000
	Rp307.846	Rp153.923.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	BGA
Mounting Style:	Clip
Heatsink Material:	Aluminum
Fin Style:	maxiFLOW
Thermal Resistance:	11.9 C/W
Length:	21 mm
Width:	21 mm
Height:	7.5 mm
Brand:	Advanced Thermal Solutions
Color:	Blue
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	superGRIP HS ASM
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW superGRIP
Type:	Component

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Datasheet

ATS-X50210B-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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Compliance Codes

USHTS:: 7616995190
MXHTS:: 7616995195
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.