ATS017017007-PF-5F

Advanced Thermal Solutions
984-ATS017017007PF5F
ATS017017007-PF-5F

Mfr.:

Description:
Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Custom Pin Fin, 17x17x7mm

Datasheet:
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Learn more about Advanced Thermal Solutions ATS017017007-PF-5F

In Stock: 23

Stock:
23 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp305.094 Rp305.094
Rp285.647 Rp2.856.470
Rp268.769 Rp5.375.380
Rp252.074 Rp12.603.700
Rp238.865 Rp23.886.500
Rp225.289 Rp45.057.800
Rp219.235 Rp109.617.500

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
Adhesive
Aluminum
Pin Fin
24.66 C/W
17 mm
17 mm
7 mm
Brand: Advanced Thermal Solutions
Color: Black
Product Type: Heat Sinks
Series: BGA High Aspect Ratio
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: Value-Line Platform
Type: Component
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Attributes selected: 0

Datasheet

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Compliance Codes
CNHTS:
7616991090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99
Origin Classifications
Country of Origin:
United States
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Pin Fin Value-Line Heat Sinks

Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks are engineered with thin and dense fields of pin-shaped cooling fins. These heat sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This process reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The pin fin heat sinks feature large surface areas that increase heat sink performance and provide high-efficiency and low-pressure drop characteristics. These heat sinks can be attached to the devices with double-sided thermal adhesive, Z-clip, or maxiGRIP™ technologies. The custom pin fin design offers an excellent cooling solution for spatially constrained PCB layouts when the airflow direction near the device is ambiguous.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

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