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HSDSJZSJZ23-19

Name: Amphenol HSDSJZSJZ23-19
Brand: Amphenol RF
SKU: 523-HSDSJZSJZ23-19
Price: 2824367 IDR
Availability: OutOfStock

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Mouser No:

523-HSDSJZSJZ23-19

Mfr. No:

HSDSJZSJZ23-19

Mfr.:

Amphenol RF

Description:

RF Cable Assemblies HSD S Jk to HSD S Jk Pn 1234-4321 1200in

Datasheet:

HSDSJZSJZ23-19 Datasheet (PDF)

ECAD Model:

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Learn more about Amphenol RF HSDSJZSJZ23-19

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 14 Weeks Estimated factory production time.

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Minimum: 25 Multiples: 1

Unit Price:

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Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp2.824.367	Rp70.609.175
	Rp2.687.689	Rp134.384.450
100	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Amphenol
Product Category:	RF Cable Assemblies
RoHS:
Connector A Series:	HSD
Connector A Gender:	Jack (Female)
Connector A Body Style:	Straight
Connector B Series:	HSD
Connector B Gender:	Jack (Female)
Connector B Body Style:	Straight
Cable Length:	30.48 m (100 ft)
Impedance:	100 Ohms
Maximum Frequency:	2 GHz
Packaging:	Bulk
Brand:	Amphenol RF
Connector A Polarity:	Normal
Connector B Polarity:	Normal
Contact Material:	Copper Alloy
Contact Plating:	Gold
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Minimum Frequency:	0 Hz
Polarity:	Normal
Product Type:	RF Cable Assemblies
Factory Pack Quantity:	1
Subcategory:	Cable Assemblies
Unit Weight:	1 kg

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Datasheet

HSDSJZSJZ23-19 Datasheet (PDF)

Technical Resources

Customer Drawing (PDF)

EU Declaration of Conformity

USHTS:: 8544200000
TARIC:: 8544200090
ECCN:: EAR99

High Speed Data (HSD) Cable Assemblies

Amphenol RF High-Speed Data (HSD) Cable Assemblies are a 100Ω connection system for differential and digital data transmission. These cable assemblies feature up to a 1.6Gbps data rate and optimized EMI shielding according to the CISPR 25 standard. Amphenol RF HSD Cable Assemblies incorporate a female contact that employs a closed entry to prevent mismatching and stubbing. Typical applications include infotainment modules, head-end units, cluster displays, and consumer ports.