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560-003-000-110

Name: EDAC 560-003-000-110
Brand: EDAC
SKU: 587-560-003-000-110
Price: 27152 IDR
Availability: InStock

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Mouser No:

587-560-003-000-110

Mfr. No:

560-003-000-110

Mfr.:

EDAC

Description:

Pin & Socket Connectors 560 Series Wire to Wire / Wire to Board 2.5mm pitch connector with 3 contact spaces, male, white, Wire Insulation oe1.00 to oe1.30

Datasheet:

560-003-000-110 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about EDAC 560-003-000-110

In Stock: 1.231

Stock:: 1.231 Can Dispatch Immediately

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Factory Lead Time:: 9 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp27.152	Rp27.152
	Rp23.116	Rp231.160
	Rp21.648	Rp541.200
	Rp20.731	Rp1.036.550
	Rp19.630	Rp1.963.000
	Rp16.475	Rp4.118.750
	Rp16.034	Rp8.017.000
	Rp15.594	Rp15.594.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	EDAC
Product Category:	Pin & Socket Connectors
RoHS:
Product:	Plug Housings
Number of Positions:	3 Position
Number of Rows:	1 Row
Pitch:	2.5 mm
Termination Style:	Crimp
Mounting Style:	Free Hanging
Housing Material:	Silicon Rubber
Voltage Rating:	250 V
Series:	560
Brand:	EDAC
Product Type:	Pin & Socket Connectors
Factory Pack Quantity:	500
Subcategory:	Pin & Socket Connectors
Unit Weight:	1,600 g

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Attributes selected: 0

Filter Document:

CNHTS:: 8538900000
CAHTS:: 8536690040
USHTS:: 8536694030
JPHTS:: 853669000
KRHTS:: 8536699000
TARIC:: 8536699099
BRHTS:: 85366990
ECCN:: EAR99

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EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

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EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

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