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MBH7BTZ43-E2

Name: FCL Components MBH7BTZ43-E2
Brand: FCL Components
SKU: 817-MBH7BTZ43-E2
Price: 1278166 IDR
Availability: OutOfStock

Mouser No:

817-MBH7BTZ43-E2

Mfr. No:

MBH7BTZ43-E2

Mfr.:

FCL Components

Description:

Bluetooth Modules - 802.15.1 BT SPP Mod Stacking connector w/Antenna

Datasheet:

MBH7BTZ43-E2 Datasheet

ECAD Model:

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More Information

Learn more about FCL Components MBH7BTZ43-E2

Availability

Stock:: Non-Stocked

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp1.278.166	Rp1.278.166
	Rp1.191.756	Rp11.917.560
	Rp1.105.530	Rp27.638.250
	Rp1.036.549	Rp103.654.900
250	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	FCL Components
Product Category:	Bluetooth Modules - 802.15.1
RoHS:
Series:	MBH7BTZ
Protocol:	Bluetooth 2.1 + EDR
Class:	Class 2
Interface Type:	GPIO, SPI, UART
Output Power:	4 dBm
Data Rate:	3 Mb/s
Receiver Sensitivity:	- 87 dBm
Frequency:	2.4 GHz
Supply Voltage - Min:	2.7 V
Supply Voltage - Max:	3.6 V
Minimum Operating Temperature:	- 20 C
Maximum Operating Temperature:	+ 70 C
Antenna:	Integrated
Brand:	FCL Components
Height:	2.3 mm
Length:	22.5 mm
Modulation Technique:	2FSK, 8DPSK, DQPSK
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Operating Supply Voltage:	2.7 V to 3.6 V
Product Type:	Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth
Protocol - Sub GHz:	ISM
Sensitivity:	- 87 dBm
Factory Pack Quantity:	1
Subcategory:	Wireless & RF Modules
Supply Current Receiving:	47 mA
Supply Current Transmitting:	44 mA
Width:	10.6 mm

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Datasheet

MBH7BTZ43-E2 Datasheet

Origin Classifications

Country of Origin:: Japan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Bluetooth® Low Energy Modules

FCL Components Bluetooth® Low Energy (BLE) Modules contain the complete verified and qualified Bluetooth low energy protocol stack, offering flexibility and a high level of customization. The BLE modules are Bluetooth V4.0 single-mode compliant and are housed in small packages. The modules feature built-in MCUs for adding upper layer profiles including private profiles and application code.