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FSM-IMX283C-000-V2A

Name: FRAMOS FSM-IMX283C-000-V2A
Brand: FRAMOS
SKU: 194-10008342
Price: 5912732 IDR
Availability: OutOfStock

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Mouser No:

194-10008342

Mfr. No:

FSM-IMX283C-000-V2A

Mfr.:

FRAMOS

Description:

Optical Sensors - Image Sensors FRAMOS Sensor Module with SONY IMX283, CMOS Rolling Shutter, color, 5496 x 3672 pixel, 1 inch, max. 25 fps, MIPI CSI-2. No mount, compatible with FSA-FT12.

Datasheet:

FSM-IMX283C-000-V2A Datasheet (PDF)

ECAD Model:

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More Information

Learn more about FRAMOS FSM-IMX283C-000-V2A

Availability

Stock:: Non-Stocked

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Factory Lead Time:: Request Delivery Quote

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Minimum: 28 Multiples: 28

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp5.912.732	Rp165.556.496

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	FRAMOS
Product Category:	Optical Sensors - Image Sensors
RoHS:
Type:	Color Sensor
Minimum Operating Temperature:	- 10 C
Maximum Operating Temperature:	+ 75 C
Resolution:	5496 x 3672
Number of frames per second:	25 fps
Pixel Size - W x H:	2.4 um x 2.4 um
Operating Supply Voltage:	1.2 V, 1.8 V, 2.9 V
Brand:	FRAMOS
Optical Format:	1 in
Product Type:	Image Sensors
Series:	Sensor Modules
Factory Pack Quantity:	28
Subcategory:	Sensors
Part # Aliases:	10008342
Unit Weight:	20 g

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Datasheet

FSM-IMX283C-000-V2A Datasheet (PDF)

Origin Classifications

Country of Origin:: Croatia
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Sensor Modules

FRAMOS Sensor Modules enable users to seamlessly integrate image sensor technology into common processing platforms. These modules feature a fully modular design that utilizes standardized connectors and mechanicals. The modules include image sensors on a PCB and have resolutions from 0.4 MP to 24 MP with both rolling and global shutter options. FRAMOS Sensor Modules are ideal for evaluating a sensor as part of a proof-of-concept design. The modules can also compare and contrast multiple sensors using a common backend and integrate them into third-party processor boards.