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FSM-IMX335C-01S-V1A

Name: FRAMOS FSM-IMX335C-01S-V1A
Brand: FRAMOS
SKU: 194-10008868
Price: 4062538 IDR
Availability: InStock

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Mouser No:

194-10008868

Mfr. No:

FSM-IMX335C-01S-V1A

Mfr.:

FRAMOS

Description:

Image Sensors FRAMOS Sensor Module with SONY IMX335, CMOS Rolling Shutter, color, 2592 x 1944 pixel, 1/2.8 inch, max. 60 fps, MIPI CSI-2. M12 mount, compatible with FSA-FT3.

Datasheet:

FSM-IMX335C-01S-V1A Datasheet (PDF)

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More Information

Learn more about FRAMOS FSM-IMX335C-01S-V1A

In Stock: 16

Stock:: 16 Can Dispatch Immediately

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Factory Lead Time:: 22 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp4.062.538	Rp4.062.538
	Rp3.808.446	Rp19.042.230
	Rp3.683.877	Rp36.838.770
	Rp3.627.371	Rp101.566.388

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	FRAMOS
Product Category:	Image Sensors
RoHS:
Type:	Color Sensor
Minimum Operating Temperature:	- 30 C
Maximum Operating Temperature:	+ 85 C
Resolution:	2592 x 1944
Number of frames per second:	60 fps
Pixel Size - W x H:	2 um x 2 um
Operating Supply Voltage:	1.2 V, 1.8 V, 2.9 V
Brand:	FRAMOS
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	HR
Optical Format:	1/2.8 in
Product Type:	Image Sensors
Series:	Sensor Modules
Factory Pack Quantity:	28
Subcategory:	Sensors
Part # Aliases:	10008868
Unit Weight:	20 g

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Datasheet

FSM-IMX335C-01S-V1A Datasheet (PDF)

USHTS:: 8525895050
ECCN:: EAR99

Sensor Modules

FRAMOS Sensor Modules enable users to seamlessly integrate image sensor technology into common processing platforms. These modules feature a fully modular design that utilizes standardized connectors and mechanicals. The modules include image sensors on a PCB and have resolutions from 0.4 MP to 24 MP with both rolling and global shutter options. FRAMOS Sensor Modules are ideal for evaluating a sensor as part of a proof-of-concept design. The modules can also compare and contrast multiple sensors using a common backend and integrate them into third-party processor boards.