0603AQC-R18J-04

Fastron
434-0603AQC-R18J-04
0603AQC-R18J-04

Mfr.:

Description:
RF Inductors - SMD Wire-wound Ceramic Chip Inductor AEC-200

Datasheet:
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 15000   Multiples: 15000
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Full Reel (Order in multiples of 15000)
Rp2.532 Rp37.980.000

Product Attribute Attribute Value Select Attribute
Fastron
Product Category: RF Inductors - SMD
RoHS:  
Inductors
Chip Inductor
AEC-Q200
Reel
Application: Medical
Brand: Fastron
Case Code - in: 0603
Case Code - mm: 1608
Core Material: Ceramic
Core Type: Wirewound
Height: 1.05 mm
Inductance: 180 nH
Length: 1.7 mm
Maximum DC Current: 400 mA
Maximum DC Resistance: 1.3 Ohms
Maximum Operating Temperature: + 140 C
Minimum Operating Temperature: - 40 C
Mounting Style: PCB Mount
Package/Case: 0603 (1608 metric)
Product Type: RF Inductors - Leaded
Q Minimum: 35
Self Resonant Frequency: 1.4 GHz
Shielding: Unshielded
Factory Pack Quantity: 15000
Termination: Standard
Termination Style: SMD/SMT
Test Frequency: 100 MHz
Tolerance: 5 %
Width: 1.12 mm
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Attributes selected: 0

Datasheet

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Compliance Codes
CNHTS:
8504500000
CAHTS:
8504500000
USHTS:
8504508000
JPHTS:
850450000
TARIC:
8504500090
MXHTS:
8504509199
BRHTS:
85045000
ECCN:
EAR99
Origin Classifications
Country of Origin:
Malaysia
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.

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