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1008F-4R7J-08

Name: Fastron 1008F-4R7J-08
Brand: Fastron
SKU: 434-1008F-4R7J-08
Price: 3266 IDR
Availability: OutOfStock

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Mouser No:

434-1008F-4R7J-08

Mfr. No:

1008F-4R7J-08

Mfr.:

Fastron

Description:

RF Inductors - SMD Chip Inductor (Wire wound -open); 4.7H; Tol: 5%

Datasheet:

1008F-4R7J-08 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Fastron 1008F-4R7J-08

Availability

Stock:: Non-Stocked

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Factory Lead Time:: Request Delivery Quote

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Minimum: 1000 Multiples: 1000

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
Full Reel (Order in multiples of 1000)
	Rp3.266	Rp3.266.000
	Rp2.899	Rp5.798.000
	Rp2.660	Rp13.300.000
	Rp2.513	Rp25.130.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Fastron
Product Category:	RF Inductors - SMD
RoHS:
Product:	RF Inductors
Type:	Wirewound
Series:	1008F
Brand:	Fastron
Inductance:	4.7 uH
Mounting Style:	PCB Mount
Packaging:	Reel
Product Type:	RF Inductors - Leaded
Qualification:	AEC-Q200
Factory Pack Quantity:	1000
Subcategory:	Inductors, Chokes & Coils
Termination Style:	SMD/SMT
Tolerance:	5 %

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Datasheet

1008F-4R7J-08 Datasheet (PDF)

Application Notes

1008F-100G-01

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Compliance Codes

CNHTS:: 8504500000
USHTS:: 8504508000
TARIC:: 8504509590
ECCN:: EAR99

Origin Classifications

Country of Origin:: Malaysia
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.