FF600R12ME4CBOSA1
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See Product Specifications
See Product Specifications
726-FF600R12ME4CBOSA
FF600R12ME4CBOSA1
Mfr.:
Description:
IGBT Modules 1200 V, 600 A dual IGBT module
IGBT Modules 1200 V, 600 A dual IGBT module
Lifecycle:
NRND:
Not recommended for new designs.
Datasheet:
Availability
-
Stock:
-
Non-StockedAn unexpected error occurred. Please try again later.
-
Factory Lead Time:
-
22 Weeks Estimated factory production time.
Pricing (IDR)
| Qty. | Unit Price |
Ext. Price
|
|---|---|---|
| Rp4.687.586 | Rp46.875.860 |
Datasheet
Application Notes
- Application Note IGBT Definition of Junction Temperature (PDF)
- Driving IGBTs with unipolar gate voltage (PDF)
- Evaluation Board for 2ED300C17 -S/ -ST (AN2007-05) (PDF)
- Evaluation Driver Board for EconoDUAL ME3, ME4 and EconoPACK+ modules (PDF)
- Industrial IGBT Modules Explanation of Technical Information (PDF)
- Module Adapter Board for EconoDUAL™3 IGBT Modules (PDF)
- Mounting instructions EconoDUAL™ 3 Modules (PDF)
- Soldering of Econo and Easy Modules (PDF)
- Transient Thermal Measurements and thermal equivalent circuit models (PDF)
- Using the NTC inside a power module (PDF)
Product Catalogs
- EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules (PDF)
- Gate Driver Selection Guide 2019 (PDF)
- Infineon's Latest Power and Sensing Guide (PDF)
- Selection Guide (PDF)
- Solutions for Industrial Drives (PDF)
- Solutions for Traction Systems (PDF)
- Solutions for Uninterruptible Power Supply (UPS) Systems (PDF)
Technical Resources
- „Econo“ my improvement in inverter-converter-moduldesign (PDF)
- 1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules (PDF)
- Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates (PDF)
- Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules (PDF)
- FPGA to Control Power Electronics (PDF)
- Gehirn trifft Muskel: FPGA steuert Leistungshalbleiter an - Article in Elektronikpraxis 05.2014 (PDF)
- IGBT Module technology state of the art and future evolutions (PDF)
- Improving Efficiency in AC drives: Comparison of Topologies and Device Technologies (PDF)
- New superior assembly technologies for modules with highest power densities (PDF)
- On the loss - softness trade-off: Are different chip versions needed for softness-improvement? (PDF)
- Saving money: SiC in UPS applications (PDF)
- The challenge of accurately analyzing thermal resistances (PDF)
Compliance Codes
- CNHTS:
- 8541290000
- CAHTS:
- 8541290000
- USHTS:
- 8541290065
- JPHTS:
- 8541290100
- TARIC:
- 8541290000
- MXHTS:
- 85412999
- ECCN:
- EAR99
Origin Classifications
- Country of Origin:
- Hungary
- Assembly Country of Origin:
- Hungary
- Country of Diffusion:
- Not available
