FS3L400R10W3S7FB11BPSA1

Infineon Technologies
726-3L400R10W3S7FB11
FS3L400R10W3S7FB11BPSA1

Mfr.:

Description:
IGBT Modules 950 V 400 A EasyPACK module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode

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In Stock: 23

Stock:
23 Can Dispatch Immediately
Factory Lead Time:
10 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 23 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp3.016.633 Rp3.016.633
Rp3.013.331 Rp24.106.648
104 Quote

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: IGBT Modules
RoHS:  
IGBT Silicon Modules
1.23 V
200 A
- 40 C
+ 125 C
Tray
Brand: Infineon Technologies
Mounting Style: Through Hole
Product Type: IGBT Modules
Factory Pack Quantity: 8
Subcategory: IGBTs
Technology: Si
Part # Aliases: FS3L400R10W3S7F_B11 SP005567323
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CAHTS:
8541290000
USHTS:
8541290065
JPHTS:
854129000
TARIC:
8541290000
MXHTS:
8541299900
ECCN:
EAR99

EasyPACK™ TRENCHSTOP™ IGBT7 Modules

Infineon Technologies EasyPACK™ TRENCHSTOP™ IGBT7 Modules are based on micro-pattern trenches technology. This provides reduced losses and offers a high level of controllability. The chip is specially optimized for industrial drive applications. The modules offer lower static losses, higher power density, and softer switching. A significant increase in power density can be obtained by raising the allowed maximum operation temperature up to 175°C in the power module.