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TGF50-07870787-059

Name: LeaderTech TGF50-07870787-059
Brand: LeaderTech
SKU: 861-TGF5007870787059
Price: 1887620 IDR
Availability: InStock

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Mouser No:

861-TGF5007870787059

Mfr. No:

TGF50-07870787-059

Mfr.:

LeaderTech

Description:

Thermal Interface Products 200mm200mm1.5mm

Datasheet:

TGF50-07870787-059 Datasheet (PDF)

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Learn more about LeaderTech TGF50-07870787-059

In Stock: 8

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Ext. Price:

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp1.887.620	Rp1.887.620
	Rp1.736.999	Rp17.369.990
	Rp1.621.053	Rp40.526.325
	Rp1.563.079	Rp78.153.950
	Rp1.505.289	Rp150.528.900
	Rp799.702	Rp199.925.500

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	LeaderTech
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Thermal Pad
Package/Case:	Non-standard
Material:	Aluminum Oxide Filled Silicone
Thermal Conductivity:	5 W/m-K
Breakdown Voltage:	7 kVAC
Color:	White
Minimum Operating Temperature:	- 50 C
Maximum Operating Temperature:	+ 180 C
Length:	200 mm
Width:	200 mm
Thickness:	1.49 mm
Tensile Strength:	0.15 MPa
Flammability Rating:	UL 94 V-0
Series:	TGF
Packaging:	Bulk
Brand:	LeaderTech
Designed for:	Heat Sink Interface, Integrated Circuits
Product Type:	Thermal Interface Products
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Thermal Resistance:	0.7 C/W

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Datasheet

TGF50-07870787-059 Datasheet (PDF)

European RoHS 3 Certificate of Conformance (PDF)

Compliance Codes

USHTS:: 8546900000
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

TGFx Thermal Gap Fillers

LeaderTech TGFx Thermal Gap Fillers are a reliable heat transfer media that fill air gaps by conforming to surface gaps and irregularities. The Thermal Gap Fillers also conduct heat from a heat source to another surface. Available in various shapes, sizes, and thermal conductivities, thermal gap fillers offer a cost-effective solution for some of the most difficult and delicate thermal situations in a broad spectrum of applications.