RN2903A-I/RM103

Microchip Technology
579-RN2903AI/RM103
RN2903A-I/RM103

Mfr.:

Description:
Sub-GHz Modules LoRa Transceiver Module 915MHz

Lifecycle:
NRND:
Not recommended for new designs.
ECAD Model:
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In Stock: 14.572

Stock:
14.572 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp319.220 Rp319.220
Rp317.753 Rp3.177.530
Rp292.068 Rp7.301.700
Rp291.885 Rp29.188.500
1.000 Quote

Product Attribute Attribute Value Select Attribute
Microchip
Product Category: Sub-GHz Modules
RoHS:  
RN2903
915 MHz
18.5 dBm
UART
3.3 V
3.3 V
122 mA
14.38 mA
- 40 C
+ 85 C
PCB
17.8 mm x 26.7 mm x 3.34 mm
LoRa/LoRaWAN
Tray
Brand: Microchip Technology
Operating Supply Voltage: 3.3 V
Product: LoRa/LoRaWAN
Product Type: Sub-GHz Modules
Factory Pack Quantity: 50
Subcategory: Wireless & RF Modules
Type: LoRa/LoRaWAN
Unit Weight: 480 mg
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Attributes selected: 0

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USHTS:
8517620090
TARIC:
8517620000
ECCN:
5A992.C

Connected (Wired & Wireless)

Microchip Technology Connectivity is easy to add to applications, as Microchip's MCUs and MPUs are designed to be compatible with Microchip wired and wireless devices. Robust, reliable, high-speed connectivity is available with a broad portfolio of wired connectivity solutions. Mobility, convenience, and enhanced user experience are possible with a wide range of wireless connectivity solutions. And, with pre-certified modules, designers can avoid worrying about communication regulations.‌

Wireless Connectivity

Microchip Technology Wireless Connectivity Solutions enable you to quickly incorporate connectivity into your designs with wireless ICs, modules, software, and development kits that make connecting effortless for your customers. Microchip's comprehensive wireless portfolio has the technology to meet your range, data rate, interoperability, frequency, and topology needs. Microchip Technology's fully certified modules enable drop-in wireless connectivity, saving development costs and reducing time to market.