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170807-2008

Name: Molex 170807-2008
Brand: Molex
SKU: 538-170807-2008
Price: 983713 IDR
Availability: OutOfStock

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Mouser No:

538-170807-2008

Mfr. No:

170807-2008

Mfr.:

Molex

Description:

Board to Board & Mezzanine Connectors NeoScale Plug Assy 100ohm 12mm 6x12

Datasheet:

170807-2008 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Molex 170807-2008

Availability

Stock:: Non-Stocked

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Factory Lead Time:: Request Delivery Quote

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Minimum: 288 Multiples: 144

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
Full Reel (Order in multiples of 144)
	Rp983.713	Rp283.309.344

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Headers
Number of Positions:	216 Position
Pitch:	2.8 mm (0.11 in)
Number of Rows:	6 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Stack Height:	12 mm
Current Rating:	1 A
Voltage Rating:	30 VAC
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 85 C
Contact Plating:	Gold
Contact Material:	Copper
Housing Material:	Liquid Crystal Polymer (LCP)
Series:	170807
Packaging:	Reel
Brand:	Molex
Flammability Rating:	UL 94 V-0
Mounting Style:	PCB
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	144
Subcategory:	Board to Board & Mezzanine Connectors
Tradename:	NeoScale
Part # Aliases:	1708072008 01708072008
Unit Weight:	14 g

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Datasheet

170807-2008 Datasheet (PDF)

Models

PCN

Product Change Notification (PDF)

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Board-to-Board Connectors

Molex Board-to-Board Connectors are available in a variety of configurations, offering an expansive array of pitches and stacking heights. The printed circuit board (PCB) is a foundational staple in the electronics industry, and with continuing trends toward miniaturization, designers need a more diverse range of solutions for creating dependable PCB connections. To fit a range of applications, Molex Board-to-Board Connectors include mezzanine, backplane, coplanar, and more. These connectors are ideal for microminiature and high-power applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

NeoScale High-Speed Mezzanine System

Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.