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170807-2017

Images are for reference only
See Product Specifications

Mouser No:

538-170807-2017

Mfr. No:

170807-2017

Mfr.:

Molex

Description:

Board to Board & Mezzanine Connectors Neoscale Plug 100ohm 18mm 6X20

Lifecycle:

Factory Special Order:

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Datasheet:

170807-2017 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Molex 170807-2017

Availability

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Series:	170807
Packaging:	Tray
Brand:	Molex
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	16
Subcategory:	Board to Board & Mezzanine Connectors
Tradename:	NeoScale
Part # Aliases:	1708072017 01708072017

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Datasheet

170807-2017 Datasheet (PDF)

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Other

RoHS Certificate (PDF)

Compliance Codes

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: Singapore
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Board-to-Board Connectors

Molex Board-to-Board Connectors are available in a variety of configurations, offering an expansive array of pitches and stacking heights. The printed circuit board (PCB) is a foundational staple in the electronics industry, and with continuing trends toward miniaturization, designers need a more diverse range of solutions for creating dependable PCB connections. To fit a range of applications, Molex Board-to-Board Connectors include mezzanine, backplane, coplanar, and more. These connectors are ideal for microminiature and high-power applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

NeoScale High-Speed Mezzanine System

Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.