170814-2009

Molex
538-170814-2009
170814-2009

Mfr.:

Description:
Board to Board & Mezzanine Connectors NeoScale Recpt 2.8mm 6x20 Gld 8mm Hght

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 240   Multiples: 80
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp2.412.499 Rp578.999.760
320 Quote

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Connectors
360 Position
2.8 mm (0.11 in)
6 Row
Vertical
1 A
30 VAC
- 55 C
+ 85 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
170814
Tray
Brand: Molex
Flammability Rating: UL 94 V-0
Mounting Style: Cable
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 16
Subcategory: Board to Board & Mezzanine Connectors
Tradename: NeoScale
Part # Aliases: 1708142009 01708142009
Unit Weight: 16,426 g
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Attributes selected: 0

Datasheet

Models

Specification Sheets

CNHTS:
8536690000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Board-to-Board Connectors

Molex Board-to-Board Connectors are available in a variety of configurations, offering an expansive array of pitches and stacking heights. The printed circuit board (PCB) is a foundational staple in the electronics industry, and with continuing trends toward miniaturization, designers need a more diverse range of solutions for creating dependable PCB connections. To fit a range of applications, Molex Board-to-Board Connectors include mezzanine, backplane, coplanar, and more. These connectors are ideal for microminiature and high-power applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

NeoScale High-Speed Mezzanine System

Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.

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