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171224-2013

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See Product Specifications

Mouser No:

538-171224-2013

Mfr. No:

171224-2013

Mfr.:

Molex

Description:

I/O Connectors zSFP+ Stacked, 2X2 W/Metal, w/outer LP

Lifecycle:

Factory Special Order:

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Datasheet:

171224-2013 Datasheet

ECAD Model:

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Availability

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	I/O Connectors
Product:	Receptacles
Gender:	Jack (Female)
Number of Positions:	80 Position
Pitch:	0.8 mm
Voltage Rating:	30 VAC
Contact Plating:	Gold
Mounting Style:	Panel Mount
Termination Style:	Through Hole
Mounting Angle:	Right Angle
Series:	171224
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Brand:	Molex
Color:	Black
Contact Material:	Copper Alloy
Current Rating:	500 mA
Features:	Stacked Ganged Assembly with Metal Spring Fingers, with outer light pipes
Flammability Rating:	UL 94 V-0
Housing Material:	Thermoplastic
Number of Ports:	4 Port
Product Type:	I/O Connectors
Factory Pack Quantity:	72
Subcategory:	I/O Connectors
Tradename:	zSFP+
Type:	Cage Assembly
Part # Aliases:	1712242013 01712242013
Unit Weight:	49,848 g

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Datasheet

171224-2013 Datasheet

Models

Specification Sheets

Product Specification Sheet (PDF)

Technical Resources

Sales Drawing (PDF)

RoHS Certificate (PDF)

Compliance Codes

USHTS:: 8536694040
TARIC:: 8536699099
ECCN:: EAR99

Origin Classifications

Country of Origin:: Indonesia
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).