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171814-1003

Name: Molex 171814-1003
Brand: Molex
SKU: 538-171814-1003
Price: 21281 IDR
Availability: InStock

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Mouser No:

538-171814-1003

Mfr. No:

171814-1003

Mfr.:

Molex
Molex

Description:

Headers & Wire Housings KK Hdr RA 3 Ckt 3.96mm Pitch 15um Au

Datasheet:

171814-1003 Datasheet

ECAD Model:

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In Stock: 1.524

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp21.281	Rp21.281
	Rp18.071	Rp180.710
	Rp15.337	Rp1.533.700
	Rp14.915	Rp3.728.750

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	Locking
Number of Positions:	3 Position
Pitch:	3.96 mm (0.156 in)
Number of Rows:	1 Row
Mounting Style:	Through Hole
Termination Style:	Solder Pin
Mounting Angle:	Right Angle
Contact Gender:	Pin (Male)
Contact Plating:	Gold
Mating Post Length:	11.33 mm (0.446 in)
Termination Post Length:	2.54 mm (0.1 in)
Series:	171814
Tradename:	KK
Application:	Wire-to-Board
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Bulk
Brand:	Molex
Contact Material:	Brass
Current Rating:	7 A
Flammability Rating:	UL 94 V-1
Housing Colour:	Black
Housing Material:	Nylon
Latching Type:	Friction Lock
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	600
Subcategory:	Headers & Wire Housings
Voltage Rating:	250 V
Unit Weight:	1,214 g

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Datasheet

171814-1003 Datasheet

Models

PCN

RoHS Certificate (PDF)

CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

KK Connectors

Molex KK Interconnection System consists of connectors that form the building block for creating thousands of different configurations. This system offers polarization features that ensure correct mating. The system incorporates offset header entry holes that provide +180°C polarization and allows both power and signal to carry through the same housing. This connector system also enables loading with optional polarization keys and pegs that ensure the one-way mating of headers and housings. Molex KK Interconnection System comes with customizable KK headers that offer more polarization options and design configurations. These include headers with voided pins, customized pin lengths, kinked PC tails, and varying tin or gold plating options.

Wire-to-Device

Molex Wire-to-Device solutions offer a wide variety of connector solutions that fit applications requiring high-power solutions or microminiature options. These Molex Wire-to-Device solutions provide reliable field performance.

Power Solutions

Molex is uniquely equipped to provide power delivery and power distribution in wire-to-wire, wire-to-board, and board-to-board configurations. Molex's wide selection of power connectors ranges from versatile to popular and proven. Designers can achieve power delivery and power distribution with Molex's vast array of power connectors.

Industrial Automation

Molex Industrial Automation connectors provide a convenient source for meeting passive interconnect and industrial communications requirements for industrial applications. Molex Industrial Automation simplifies design, installation, and maintenance processes.

Industrial Solutions

Molex Industrial Solutions offer robust products designed for the harshest environmental conditions to deliver safe and reliable connections. These products also provide protection from contamination, moisture, or vibration. The Molex Industrial Solutions lineup features high performance and a long product life.

KK 396 RPC Headers

Molex KK 396 Reflow Process Compatible (RPC) Connector System delivers up to 13A and 600V per circuit and supports a lead-free solder process. Molex KK 396 Connector System is ideal for low- to mid-power wire-to-board and board-to-board applications. KK 396 RPC connector system is designed to support RoHS lead-free initiatives. Designed with a nylon housing, the wire-to-board system can withstand temperatures up to +260°C. These right-angle and vertical headers are ideal for use in a variety of consumer, data/computing, medical, and automotive applications.