215760-3003

Molex
538-215760-3003
215760-3003

Mfr.:

Description:
Headers & Wire Housings Micro-Fit+ RA Header 3 Circuits Black

ECAD Model:
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In Stock: 2.523

Stock:
2.523 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp45.865 Rp45.865
Rp39.627 Rp396.270
Rp33.940 Rp848.500
Rp33.206 Rp3.320.600
Rp30.087 Rp6.950.097
Rp28.620 Rp13.222.440
Rp28.253 Rp32.632.215
Rp25.501 Rp64.798.041
Rp24.584 Rp124.935.888

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Headers
PCB Receptacle
3 Position
3 mm (0.118 in)
1 Row
PCB Mount
Solder Pin
Right Angle
Gold
215760
Micro-Fit+
Wire-to-Board, Power
- 40 C
+ 105 C
Tray
Brand: Molex
Contact Material: Copper Alloy
Current Rating: 13 A
Flammability Rating: UL 94 V-0
Housing Colour: Black
Housing Gender: Receptacle
Housing Material: Liquid Crystal Polymer (LCP)
Insulation Resistance: 1 GOhms
Product Type: Headers & Wire Housings
Factory Pack Quantity: 231
Subcategory: Headers & Wire Housings
Voltage Rating: 600 VAC/600 VDC
Part # Aliases: 2157603003 02157603003
Products found:
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Attributes selected: 0

Compliance Codes
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Micro-Fit+ Connectors

Molex Micro-Fit+ Connectors offer superior design options for flexibility and efficient assembly. The connectors offer a high current rating of up to 13.5A with a 3mm pitch and use the same amount of space that smaller connectors occupy. Features include a smaller PCB footprint, a reduced mating force of 40%, and an enhanced TPA design that provides stability and security for the terminals inside the receptacle. Molex Micro-Fit+ applications include consumer, telecommunication/networking, medical, sustainable energy, and automotive.