87715-9105

Molex
538-87715-9105
87715-9105

Mfr.:

Description:
PCI Express/PCI Connectors VERT THRU-HOLE 64P 15 plated

ECAD Model:
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In Stock: 5.749

Stock:
5.749 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp58.524 Rp58.524
Rp56.689 Rp566.890
Rp50.085 Rp1.252.125
Rp48.617 Rp4.861.700
Rp47.516 Rp11.879.000
Rp46.599 Rp23.299.500
Rp36.692 Rp36.692.000
Rp31.739 Rp53.321.520

Product Attribute Attribute Value Select Attribute
Molex
Product Category: PCI Express/PCI Connectors
RoHS:  
PCI Express
64 Position
Through Hole
Vertical
Through Hole
Tin
Gold
87715
Brand: Molex
Current Rating: 1.1 A
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Packaging: Tray
Product Type: PCI Express / PCI Connectors
Factory Pack Quantity: 1680
Subcategory: Card Edge Connectors
Voltage Rating: 50 VAC/DC
Part # Aliases: 0877159105
Unit Weight: 3,866 g
Products found:
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Attributes selected: 0

Compliance Codes
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

PCI Express Edgecard Connectors

Molex PCI Express Edgecard Connectors offer a third-generation I/O architecture. PCI-SIG revised the PCI Express specifications from version 1.1 to version 2.0. This revision doubles the PCI Express interconnect bit rate from 2.5GT/s (gigatransfer per second) to 5GT/s per lane. PCI Express supports high-bandwidth applications and is also backward compatible with PCI Express 1.1 version products.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.