EYG-R0909ZRX2

Panasonic
667-EYG-R0909ZRX2
EYG-R0909ZRX2

Mfr.:

Description:
Thermal Interface Products 90 mmx90 mmx0.35 mm200 W/m-K - 55 C+ 400 C

Datasheet:
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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
448
Expected 05/06/2026
4.490
800
Expected 07/09/2026
1.750
Expected 10/09/2026
1.940
Expected 15/10/2026
Factory Lead Time:
16
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp332.796 Rp332.796
Rp294.453 Rp2.944.530
Rp277.758 Rp5.555.160
Rp270.237 Rp13.511.850
Rp260.513 Rp26.051.300
Rp248.038 Rp49.607.600
Rp239.048 Rp119.524.000

Product Attribute Attribute Value Select Attribute
Panasonic
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
High Compressible Graphite Sheet
Non-standard
Graphite
200 W/m-K
Gray
- 55 C
+ 400 C
90 mm
90 mm
0.35 mm
600 kPa
UL 94 V-0
EYGR
Bulk
Brand: Panasonic
Product Type: Thermal Interface Products
Factory Pack Quantity: 10
Subcategory: Thermal Management
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Attributes selected: 0

Datasheet

Compliance Codes
CNHTS:
8545900000
CAHTS:
8545900000
USHTS:
8545904000
MXHTS:
8545909900
ECCN:
EAR99
Origin Classifications
Country of Origin:
Japan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

EYG-R GraphiteTIM Pyrolytic Graphite Sheets

Panasonic EYG-R GraphiteTIM Pyrolytic Graphite Sheets (PGS) is comprised of low thermal resistance thermal management material in 250µm and 350µm thickness options. An ideal Thermal Interface Material (TIM) solution, Panasonic EYG-R GraphiteTIM material is designed with high-compressibility characteristics to reduce contact thermal resistance between rough surfaces. EYG-R GraphiteTIM material is easy to install with a one-to-two-step process that is more cost-effective than thermal grease. GraphiteTIM has very high compressibility compared to standard PGS, which reduces thermal resistance by following gap, warpage, and distortion of targets/substrates.

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