DA14706-00000HZ2

Renesas / Dialog
724-DA14706-00000HZ2
DA14706-00000HZ2

Mfr.:

Description:
RF System on a Chip - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

Datasheet:
ECAD Model:
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Learn more about Renesas / Dialog DA14706-00000HZ2

In Stock: 3.206

Stock:
3.206 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 3206 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (IDR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
Rp247.488 Rp247.488
Rp204.925 Rp2.049.250
Rp191.349 Rp4.783.725
Rp174.837 Rp17.483.700
Rp166.215 Rp41.553.750
Rp161.261 Rp80.630.500
Rp157.409 Rp157.409.000
Rp157.225 Rp314.450.000
Full Reel (Order in multiples of 4000)
Rp152.272 Rp609.088.000
† A MouseReel™ fee of Rp98.000 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Renesas Electronics
Product Category: RF System on a Chip - SoC
RoHS:  
Bluetooth
ARM Cortex M33
2.4 GHz
6 Mbps
6 dBm
- 97 dBm
2.9 V
4.75 V
1.85 mA
3 mA
4 kB, 32 kB
- 40 C
+ 85 C
VFBGA-142
Reel
Cut Tape
MouseReel
Brand: Renesas / Dialog
Data RAM Size: 1.5 MB
Maximum Clock Frequency: 160 MHz, 2.4 GHz
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Number of I/Os: 79 I/O
Product Type: RF System on a Chip - SoC
Series: DA14706
Factory Pack Quantity: 4000
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
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Attributes selected: 0

Datasheet

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CNHTS:
8542319092
USHTS:
8542310070
ECCN:
5A992.C

DA14706 Highly Integrated Advanced Wireless MCU

Renesas / Dialog DA14706 Highly Integrated Advanced Wireless MCU has integrated application processors, 2D Graphics processors, Voice Activity Detector (VAD), and Power Management Unit (PMU).  It's the only product in the BLUETOOTH® LE space to offer this level of integration. This allows for cost-effective and reliable form factor designs for complex sensor and graphical processing applications.

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