R5F565N4BGFP#10

Renesas Electronics
968-R5F565N4BGFP#10
R5F565N4BGFP#10

Mfr.:

Description:
32-bit Microcontrollers - MCU 32BIT MCU RX65N 512K/256K QFP100

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
18 Weeks Estimated factory production time.
Minimum: 720   Multiples: 720
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp94.665 Rp68.158.800

Product Attribute Attribute Value Select Attribute
Renesas Electronics
Product Category: 32-bit Microcontrollers - MCU
RoHS:  
RX65N
Tray
Brand: Renesas Electronics
Product Type: 32-bit Microcontrollers - MCU
Factory Pack Quantity: 720
Subcategory: Microcontrollers - MCU
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Compliance Codes
CNHTS:
8542319090
CAHTS:
8542310000
USHTS:
8542310025
TARIC:
8542319000
ECCN:
3A991.a.2
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

RX600 32-bit Microcontrollers

Renesas Electronics RX600 32-bit Microcontrollers are optimized for high speed and excellent performance. The RX600 MCUs employ up to 4MB of flash memory and features zero-wait access. This extracts the full performance potential of the maximum operating frequency of 120MHz. The RX600 Series MCUs are provided with a single-precision FPU, a 32-bit multiplier and divider, and a 32-bit multiply-and-accumulate (MAC) unit. These enable the fast execution and real-time performance required for filtering operation or motor feedback control.

RX651 & RX65N RX Microcontrollers

Renesas Electronics RX651 and RX65N RX Microcontrollers add four 64-pin MCUs to mainstream RX651 and RX65N MCUs that use the RXv2 Core CPU. The 64-pin MCUs enable security and flash functionality for industrial applications. Each Renesas MCU's Trusted Secure IP (TSIP) and Flash area protection provides root of trust device operation. The dual-bank flash feature (BGO and swap) makes the flash firmware update easier through secure network communication. The 64-pin package reduces the PCB footprint area for IoT edge applications.

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