ASP-209946-01

Samtec
200-ASP-209946-01
ASP-209946-01

Mfr.:

Description:
Board to Board & Mezzanine Connectors

ECAD Model:
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In Stock: 604

Stock:
604 Can Dispatch Immediately
Factory Lead Time:
2 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp441.038 Rp441.038
Full Reel (Order in multiples of 500)
Rp399.576 Rp199.788.000
1.000 Quote

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Connectors
ASP
Reel
Cut Tape
Brand: Samtec
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 500
Subcategory: Board to Board & Mezzanine Connectors
Tradename: SEARAY
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Attributes selected: 0

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

Industry Standards Solution

Samtec's Industry Standards Solution improves compatibility, performance, and efficiency. Samtec provides connector products that interact with many types of hardware and software. This drives the need to adhere to a variety of Industry Standards.

COM-HPC™ Interconnect Solutions

Samtec COM-HPC™ Interconnect Solutions offer up to 300W power rating, 400 total pins, and up to 32Gbps per channel. COM-HPC solutions provide ultra-high-speed performance and extended connectivity with limitless scalability, ensuring to meet the growing demands. These high-density interconnecting systems meet the COM-HPC standard for high-performance Computer-on-Modules. Samtec COM-HPC Interconnect Solutions are ideal for medical imaging, embedded edge servers, 5G connected vehicles, 5G wireless infrastructure, and industrial applications.