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EBTM-4-08-2.0-S-VT-1-R

Name: Samtec EBTM-4-08-2.0-S-VT-1-R
Brand: Samtec
SKU: 200-EBTM4082.0SVT1R
Price: 454064 IDR
Availability: InStock

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Mouser No:

200-EBTM4082.0SVT1R

Mfr. No:

EBTM-4-08-2.0-S-VT-1-R

Mfr.:

Samtec

Description:

High Speed/Modular Connectors ExaMAX 2.00 mm High-Speed Backplane Vertical Header

Datasheet:

EBTM-4-08-2.0-S-VT-1-R Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec EBTM-4-08-2.0-S-VT-1-R

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33 Can Dispatch in 20 Days

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp454.064	Rp454.064
	Rp414.987	Rp4.149.870
	Rp379.212	Rp11.376.360
	Rp346.556	Rp20.793.360
	Rp314.450	Rp37.734.000
	Rp289.133	Rp78.065.910
	Rp266.017	Rp135.668.670
1.020	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	64 Position
Number of Rows:	8 Row
Pitch:	2 mm
Termination Style:	Solder Pin
Contact Plating:	Gold
Series:	EBTM
Packaging:	Tray
Brand:	Samtec
Contact Material:	Copper Alloy
Current Rating:	4.2 A
Housing Colour:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Straight
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	30
Subcategory:	Backplane Connectors
Tradename:	ExaMAX

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Datasheet

EBTM-4-08-2.0-S-VT-1-R Datasheet (PDF)

Models

EBTM-4-08-2.0-S-VT-1-R Symbol & Footprint by SnapMagic

Compliance Codes

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: United States
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

ExaMAX® High-Speed Backplane System

Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.