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HDTM-3-06-1-S-VT-2-1

Name: Samtec HDTM-3-06-1-S-VT-2-1
Brand: Samtec
SKU: 200-HDTM3061SVT21
Price: 211896 IDR
Availability: OutOfStock

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Mouser No:

200-HDTM3061SVT21

Mfr. No:

HDTM-3-06-1-S-VT-2-1

Mfr.:

Samtec

Description:

Headers & Wire Housings

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HDTM-3-06-1-S-VT-2-1 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-3-06-1-S-VT-2-1

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 3 Weeks Estimated factory production time.

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Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp211.896	Rp211.896
	Rp183.827	Rp4.595.675
	Rp155.391	Rp8.391.114
	Rp113.011	Rp12.205.188
	Rp98.335	Rp53.100.900
	Rp89.345	Rp91.667.970
	Rp77.787	Rp197.423.406
5.022	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Headers & Wire Housings
Brand:	Samtec
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	54
Subcategory:	Headers & Wire Housings

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Datasheet

HDTM-3-06-1-S-VT-2-1 Datasheet (PDF)

Origin Classifications

Country of Origin:: Not available
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.