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HDTM-3-06-2-S-VT-0-3

Name: Samtec HDTM-3-06-2-S-VT-0-3
Brand: Samtec
SKU: 200-HDTM-3062SVT03
Price: 201623 IDR
Availability: OutOfStock

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Mouser No:

200-HDTM-3062SVT03

Mfr. No:

HDTM-3-06-2-S-VT-0-3

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:

HDTM-3-06-2-S-VT-0-3 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-3-06-2-S-VT-0-3

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 3 Weeks Estimated factory production time.

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Ext. Price:

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp201.623	Rp201.623
	Rp175.021	Rp4.375.525
	Rp147.869	Rp7.393.450
	Rp109.342	Rp58.935.338

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Rows:	6 Row
Pitch:	1.8 mm
Termination Style:	Solder Pin
Contact Plating:	Gold
Series:	HDTM
Packaging:	Tray
Brand:	Samtec
Contact Material:	Copper Alloy
Housing Colour:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Maximum Operating Temperature:	+ 105 C
Minimum Operating Temperature:	- 40 C
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	77
Subcategory:	Backplane Connectors
Tradename:	XCede

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Datasheet

HDTM-3-06-2-S-VT-0-3 Datasheet (PDF)

Technical Resources

Dimensional Drawing, Footprint, and Part Number Configuration

Compliance Codes

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.