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HDTM-3-06-2-S-VT-5-R-3

Name: Samtec HDTM-3-06-2-S-VT-5-R-3
Brand: Samtec
SKU: 200-HDTM3062SVT5R3
Price: 217767 IDR
Availability: OutOfStock

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See Product Specifications

Mouser No:

200-HDTM3062SVT5R3

Mfr. No:

HDTM-3-06-2-S-VT-5-R-3

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HDTM-3-06-2-S-VT-5-R-3 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-3-06-2-S-VT-5-R-3

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 3 Weeks Estimated factory production time.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp217.767	Rp217.767
	Rp196.302	Rp1.963.020
	Rp175.021	Rp4.375.525
	Rp145.117	Rp13.931.232

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Packaging:	Tray
Brand:	Samtec
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	48
Subcategory:	Backplane Connectors

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Datasheet

HDTM-3-06-2-S-VT-5-R-3 Datasheet (PDF)

Compliance Codes

USHTS:: 8536694040

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.