HDTM-3-08-1-S-VT-5-R-1

Samtec
200-HDTM3081SVT5R1
HDTM-3-08-1-S-VT-5-R-1

Mfr.:

Description:
High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
3 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp233.178 Rp233.178
Rp210.429 Rp2.104.290
Rp187.313 Rp4.682.825
Rp153.006 Rp12.852.504
Rp136.678 Rp34.442.856
Rp125.854 Rp63.430.416
Rp112.278 Rp113.176.224
Rp98.885 Rp199.352.160

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: High Speed/Modular Connectors
Tray
Brand: Samtec
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 42
Subcategory: Backplane Connectors
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Attributes selected: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.