HDTM-3-08-1-S-VT-5-R-2

Samtec
200-HDTM3081SVT5R2
HDTM-3-08-1-S-VT-5-R-2

Mfr.:

Description:
High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
4 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp224.188 Rp224.188
Rp202.173 Rp2.021.730
Rp180.158 Rp4.503.950
Rp147.135 Rp12.359.340
Rp131.541 Rp33.148.332
Rp121.267 Rp61.118.568
Rp108.425 Rp109.292.400
Rp95.583 Rp192.695.328

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: High Speed/Modular Connectors
Headers
48 Position
8 Row
1.8 mm
Solder Pin
Tray
Brand: Samtec
Contact Material: Phosphor Bronze
Current Rating: 1.5 A
Housing Material: Liquid Crystal Polyer (LCP)
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 40 C
Mounting Angle: Vertical
Orientation: Straight
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 42
Subcategory: Backplane Connectors
Voltage Rating: 48 VAC
Products found:
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Attributes selected: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.