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HDTM-3-08-2-S-VT-2-1

Name: Samtec HDTM-3-08-2-S-VT-2-1
Brand: Samtec
SKU: 200-HDTM3082SVT21
Price: 212080 IDR
Availability: OutOfStock

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Mouser No:

200-HDTM3082SVT21

Mfr. No:

HDTM-3-08-2-S-VT-2-1

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:

HDTM-3-08-2-S-VT-2-1 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-3-08-2-S-VT-2-1

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 3 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp212.080	Rp212.080
	Rp191.349	Rp1.913.490
	Rp170.434	Rp4.260.850
	Rp139.246	Rp7.519.284
	Rp120.900	Rp13.057.200
	Rp110.076	Rp59.441.040
	Rp95.399	Rp97.879.374
	Rp81.089	Rp166.394.628

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Packaging:	Tray
Brand:	Samtec
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	54
Subcategory:	Backplane Connectors

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Datasheet

HDTM-3-08-2-S-VT-2-1 Datasheet (PDF)

Technical Resources

Dimensional Drawing, Footprint, and Part Number Configuration

Compliance Codes

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: United States
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.