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HDTM-4-08-2-S-VT-0-3

Name: Samtec HDTM-4-08-2-S-VT-0-3
Brand: Samtec
SKU: 200-HDTM4082SVT03
Price: 248955 IDR
Availability: OutOfStock

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See Product Specifications

Mouser No:

200-HDTM4082SVT03

Mfr. No:

HDTM-4-08-2-S-VT-0-3

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HDTM-4-08-2-S-VT-0-3 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-4-08-2-S-VT-0-3

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 6 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp248.955	Rp248.955
	Rp224.372	Rp2.243.720
	Rp199.971	Rp4.999.275
	Rp163.279	Rp8.163.950
	Rp150.437	Rp15.043.700
	Rp141.631	Rp35.691.012
	Rp128.972	Rp65.001.888
	Rp111.911	Rp112.806.288
	Rp95.032	Rp191.584.512

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Product:	Headers
Number of Positions:	64 Position
Number of Rows:	8 Row
Pitch:	1.8 mm
Termination Style:	Solder Pin
Packaging:	Tray
Brand:	Samtec
Contact Material:	Phosphor Bronze
Current Rating:	1.5 A
Housing Material:	Liquid Crystal Polyer (LCP)
Maximum Operating Temperature:	+ 105 C
Minimum Operating Temperature:	- 40 C
Mounting Angle:	Vertical
Orientation:	Straight
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	63
Subcategory:	Backplane Connectors
Voltage Rating:	48 VAC

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Datasheet

HDTM-4-08-2-S-VT-0-3 Datasheet (PDF)

Compliance Codes

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: United States
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.