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IMPCC-02-02

Name: Samtec IMPCC-02-02
Brand: Samtec
SKU: 200-IMPCC-02-02
Price: 37976 IDR
Availability: InStock

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Mouser No:

200-IMPCC-02-02

Mfr. No:

IMPCC-02-02

Mfr.:

Samtec

Description:

Power to the Board mPOWER Cable Holder for Socket Housing

Datasheet:

IMPCC-02-02 Datasheet (PDF)

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Learn more about Samtec IMPCC-02-02

In Stock: 211

Stock:: 211 Can Dispatch Immediately

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Factory Lead Time:: 1 Week Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp37.976	Rp37.976
	Rp29.721	Rp2.972.100
	Rp28.069	Rp14.034.500

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Power to the Board
RoHS:
Product Type:	Power to the Board
Contact Gender:	Without Socket Contacts
Voltage Rating:	300 V
Number of Positions:	2 Position
Mounting Style:	Cable Mount / Free Hanging
Termination Style:	Crimp
Pitch:	2 mm
Series:	IMPCC
Packaging:	Bulk
Tradename:	mPOWER
Brand:	Samtec
Contact Material:	Copper Alloy
Housing Colour:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Mounting Angle:	Straight
Number of Rows:	1 Row
Product:	Wire Housings
Factory Pack Quantity:	1
Subcategory:	Power Connectors

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Datasheet

IMPCC-02-02 Datasheet (PDF)

Specification Sheets

Compliance Codes

USHTS:: 8538908180
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

mPOWER® Ultra Micro Power Connectors

Samtec mPOWER^® Ultra Micro Power Connectors feature 2mm power blade interconnects, delivering up to 18A (460V_AC/651V_DC maximum) in a small form factor to support board-to-board and cable-to-board applications. The mPOWER connector system provides a versatile, high-power micro solution with exceptional design flexibility across a single product family. With a wide range of stack heights, the mPOWER series integrates easily into new or existing architectures. Discrete wire cable assemblies streamline board layout while efficiently delivering power directly to the system's active components.