FS1406-2640-AS

TDK
810-FS1406-2640-AS
FS1406-2640-AS

Mfr.:

Description:
DC/DC Converters - SMD 2.64V uPOL 6A Power Module

Datasheet:
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Learn more about TDK FS1406-2640-AS

In Stock: 239

Stock:
239 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 239 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp110.626 Rp110.626
Rp108.792 Rp543.960
Rp107.141 Rp1.071.410
Rp102.738 Rp2.568.450
Rp101.086 Rp5.054.300
Rp99.435 Rp9.943.500
Full Reel (Order in multiples of 250)
Rp94.482 Rp23.620.500
Rp90.996 Rp45.498.000
Rp90.629 Rp90.629.000

Product Attribute Attribute Value Select Attribute
TDK
Product Category: DC/DC Converters - SMD
RoHS:  
Non-Isolated
1 Output
4.5 V
16 V
2.64 V
6 A
SMD-17 Module
3.3 mm (0.13 in)
3.3 mm (0.13 in)
1.5 mm (0.059 in)
Industrial
FS1406
Brand: TDK
Case Style: Open Frame
Input Voltage: 4.5 V to 16 V
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 40 C
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Packaging: Reel
Packaging: Cut Tape
Product: Non-Isolated / PoL
Product Type: Non-Isolated DC-DC Converters
Factory Pack Quantity: 250
Subcategory: DC-DC Converters
Tradename: uPOL
Part # Aliases: FS1406-2640-AS -
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Compliance Codes
USHTS:
8504409580
TARIC:
8504409590
ECCN:
EAR99
Origin Classifications
Country of Origin:
Taiwan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

μPOL™ DC-DC Power Modules

TDK μPOL™ DC-DC Power Modules are compact and highly integrated point-of-load (POL) converters. These modules are ideal for powering CPUs, MCUs, ASICs, FPGAs, DSPs and other advanced digital logic devices. The µPOL high current density power modules provide the high performance, fast load transient response and high accuracy voltage regulation required by these devices. These Micro-POL converters feature a chip-embedded power IC in a thermally enhanced semiconductor-embedded-in-substrate package.

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